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Introduction to PCB Surface Finishing Processes

13 May 2025 13:36:53 GMT

Table of ContentsRequirements for PCB Surface Coating in SMT AssemblySurface Coating Types: Common surface coating types include electroless Ni/Au, electroless Ag, electroless Sn, OSP (Organic Solderability Preservative), and lead-free hot air levelin…

Three PCB Fabrication Styles & Their Process Flows

12 May 2025 15:16:29 GMT

Table of ContentsDescriptionPCB fabrication styles are divided into direct fabrication system, direct - circular fabrication system, and circular fabrication system. The accoutrements used are photosensitive paste, photosensitive film, and circular fi…

LED Packaging PCB and DPC Ceramic PCB

07 May 2025 16:31:08 GMT

Table of Contents1. The Importance of Thermal Conductivity in LED Packaging PCBsAs the carrier of heat convection with air, the thermal conductivity of the power-type LED packaging PCB plays a decisive role in the heat dissipation of LEDs. DPC ceramic…

Ultra-Thick Copper Multilayer PCB Manufacturing Process

06 May 2025 11:48:54 GMT

Ultra-thick copper multilayer PCBs are integrated connection devices with the function of connecting strong and weak currents. This paper focuses on the manufacturing process of ultra-thick copper multilayer PCBs with a thickness over 0.41 mm. By usin…

Effects and Selection of PCB Panelization Methods

28 Apr 2025 14:35:30 GMT

Table of ContentsWhat are the effects of different PCB panelization methods?In the design and production process of PCB, the panelization method can directly affect production efficiency, cost and finished product quality. Panelization combines multi…

What is wave soldering?

28 Apr 2025 11:01:00 GMT

Table of ContentsWave soldering is to use a wave soldering machine to directly contact the soldering surface of the plug-in board with high-temperature liquid tin to achieve soldering. When the component passes through the solder wave, the solder wave…

Ceramic PCB:Types (HTCC/LTCC) & Uses

27 Apr 2025 17:29:03 GMT

What is Ceramic PCB?Ordinary PCBs are typically made by bonding copper foil to a substrate, with most substrates composed of materials like fiberglass (FR-4) or phenolic resin (FR-3), and adhesives usually being phenolic or epoxy. In contrast, cerami…

A Simple Guide to EMC Design in PCBs

25 Apr 2025 14:19:44 GMT

Table of Contents1. Layer Stack-Up1.1 Layer SetupIn PCB EMC design, first choose the layer stack-up. The board’s layers include power planes, ground planes, and signal layers. How you place and split these planes affects EMC performance.1.2 Choosing …

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