PCB Capabilities
PCBA Capabilities
| Our PCB factory specializes in the production of single and double-sided, multi-layer high-precision printed circuit boards, with over ten years of experience in PCB design,prototyping, and manufacturing. *Factory area is around 16000m2, Output: 2000m2/month,over 3000 PCB categories orders *PCB Range: Up to 32layers multi-layer rigid PCB,HDI(3+n+3),mixed substrate PCB,heavy copper PCB,High-frequency PCB,Aluminum-base PCB,halogen-free PCB *Express in 24 hours,PCB Free sample supported *IPC-Class2 Standard,IPC-Class3 Standard | ||
| Item | Prototype | Bulk Order |
| PCB Material | FR4,Ceramic ,Aluminum base, Copper base,Others | FR4,Ceramic, Aluminum Base, Copper Base, Others |
| PCB Type | Single-sided/Multi-layer PCB/HDI/High Frequency PCB/High Speed PCB/Heavy Copper PCB | |
| Number of Layers | 2-64 | 2-32 |
| PCB Thinckess | 0.2-3.5mm | |
| PCB SIZE(Max.) | 1050*610MM | 800*600MM |
| Copper Foil Thickness | 1/4-12OZ | 1/3-6OZ |
| Mechenical Hole | 5mil(0.127mm) | 6mil(0.15mm) |
| Laser Hole | 3mil(0.076mm) | 4mil(0.1mm) |
| Line Width/Spacer | Inner Layer1.8/1.8mil, top layer2/2mil | Inner Layer2/2mil, top layer2.5/2.5mil |
| Outline Tolerance | ±2mil(0.05mm) | ±3mil(0.076mm) |
| BAG Solder Pad | 7mil(0.18mm) | 8mil(0.2mm) |
| Through Hole Aspect Ratio | 20:1 | 12:1 |
| Blind Hole Aspect Ratio | 1:1 | 1:1.2 |
| Impedance Tolerance | 5% | 8% |
| Distance From Hole To Inner Layer Circuit | 5mil(0.127mm) | 6mil(0.15mm) |
| Inter-layer Alignment | 2mil(0.05mm) | 3mil(0.076mm) |
| Special Process | Center Hole, Step Hole, Countersunk Hole, Crimping Hole, Back Drilling,Two Steps, Buried Capacitor And Buried Resistor | Center Hole, Step Hole, Countersunk Hole, Crimping Hole, Back Drilling |
| Surface Treatment | HASL, ENIG, Immersion Tin, OSP, Immersion Silver,Electroplating Hard Gold/Soft Gold, Gold Finger, | |
| Copper Thickness of Outer Layer(Max.) | 6OZ | |
| Soldermask Bridge Width | 0.01mm | |
| Aperture Ratio | 10:1 | |
| Soldermask Color | White, Green, Yellow, Red, Black,Blue,Pink,Purple,Others | |
| Gold Finger Hypotenuse Angle | 20° | |
| Gold Finger Bevel Depth | 0.1mm | |
| V-cut | Normal v-cut, Jumping v-cut | Normal v-cut, Jumping v-cut |
| Panel Size(Max.) | 20*20inch | 20*20inch |
| Panel Size(Min.) | 100*120mm | 100*120mm |
| HDI PCB-Structure | Any Layer(10L) | |
| HDI PCB-Width/Space (Outer Layer) | 2.5mil/2.5mil | |
| Aspect Ratio(Blind Hole) | 1:1 | |
| Solder Ring(Min.) | 3mil | |
| BGA Pad Diameter(Min.) | 8mil | |
| PCB Thickness(Min.) | 0.15mm(2L) | |
| Finished Board Size(Min.) | 10mm | |
| Impedance Tolerance | ±10%, 50Ωor less:±5Ω | |
| Bending Tolerance | 0.50% | 0.70% |
| Tin Spray Hole Diameter(Min.) | 0.4mm | 0.5mm |
| Circuit Spray Tin(Min Spacer) | 10mil | 12mil |
| Acceptance Criteria | IPC2,IPC3 | |
| Manufacturing capabilities cover a wide range of industries, including BMS, PLC, Medical, Automotive, Satellite, Army equipment, industrial control motherboards and power supply, computer, Server, STB, LCD driver motherboards, MPPT, New Energy, Fiber, GPS, MID,etc. For more Inqueries,kindly please contact our marking department by email: [email protected] | ||