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How Reflow Ovens Enhance PCB Assembly Quality

30 May 2025 16:38:07 GMT 14

Table of ContentsIn the modern electronics manufacturing industry, particularly in the circuit board assembly process, the application of soldering technology is becoming increasingly widespread, and the reflow oven is a key piece of equipment that en…

PCB Design Guidelines: Size, Materials, Layout & Marking

30 May 2025 14:55:50 GMT 15

Table of Contents1.1、PCB Dimensions and ShapeThe welding process dimensions for PCB board shape are width (200mm–250mm) length (250mm–300mm).For PCBs with a long side shorter than 125mm or a short side shorter than 100mm, a panelization method can…

From Schematic to PCB: Power Supply Design Guide

29 May 2025 17:35:40 GMT 18

Table of ContentsIn any switching power supply design, the physical design of the PCB is the final step. If the design method is improper, the PCB may radiate excessive electromagnetic interference, causing unstable operation of the power supply. The …

How to Improve Wrinkling of Copper Foil in PCB Lamination

28 May 2025 17:19:03 GMT 19

Table of Contents1. PrefaceDuring the PCB lamination process, PP resin undergoes changes in states: "glass state → high - elastic state → viscous flow state → high - elastic state → glass state". Due to factors such as graphic design, fl…

Capacitance Testing in PCB Electrical Performance Analysis

23 May 2025 17:46:07 GMT 19

Table of ContentsIn PCB electrical performance testing, there are various testing methods, and the capacitance testing method is a very important means. This article starts with the basic principles of capacitance and introduces the application of the…

BGA and SMD Rework Guide: Steps, Tips & Ball Planting

22 May 2025 17:57:18 GMT 24

Table of ContentsOrdinary ReworkPrinciple of Ordinary SMD Rework System: Heat airflow is concentrated on the pins and pads of surface mount devices (SMDs) to melt solder joints or reflow solder paste, enabling disassembly and welding functions.The mai…

Pin Grid Array (PGA) vs Ball Grid Array (BGA) Guide

22 May 2025 15:33:50 GMT 33

Table of ContentsPGA Packaging (Pin Grid Array)Chips packaged with this technology feature multiple square arrays of pins both inside and outside. Each square array of pins is arranged at specific intervals along the chips perimeter, forming 2 to 5 co…

What are dry solder joints and solder beads?

20 May 2025 14:48:11 GMT 29

Table of ContentsDuring the PCB (printed circuit board) assembly process, dry solder joints and solder beads are very common welding defects, which may cause circuit malfunction or even failure. Lets take a deeper look at what dry solder joints and so…

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